Amphenol CS BergStik® Unshrouded Headers

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Amphenol CS BergStik® 2.54mm unshrouded headers

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BergStik® 2.54mm unshrouded headers are available in surface-mount (SMT), through-hole (THT), press-fit, stacking and pin-in-paste (PIP) versions. Designed in single and double row, they are available in straight or right angle options, from 2positions to 72 positions.

Featuring a “breakaway” design, each connector can be cut or broken to length to suit the application profile. The maximum current rating is 3A per contact. This product range is extended with BergStik® 2.54mm unshrouded vertical headers in 0.25μm plating, available in standard sizes. It offers an economical solution for various applications. It is also specified up to 100 mating cycles.

BergStik® product range provides board-to-board, wireto-board and cable-to-board interconnect solutions for all electronic equipment and devices.

Amphenol FCI BergStik® 2.54mm unshrouded headers - Avnet Abacus

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Features and benefits

Table


High temperature thermoplastic material Variable spacing height for stacking headers Allow dual entry; mating from top or bottom Blank 0.64mm square contacts presents 4 surfaces of equal quality Standoff design Duplex plating Tin-lead plating in press-fit area Retention legs option Press-fit designed to fit 1.02mm diameter hole, solder-to board product Meets DIN 41651 specification, HE13 and BT D2632	Reflow compatible Cater to a wide range of applications Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements Can be used for wire wrapping Allows cleaning to remove soldering contamination Cost-efficient Easy pin insertion onto PCB High retention force onto PCB Same layout on THT and press-fit Qualified product

High temperature thermoplastic material
Variable spacing height for stacking headers
Allow dual entry; mating from top or bottom
Blank 0.64mm square contacts presents 4 surfaces of equal quality
Standoff design
Duplex plating
Tin-lead plating in press-fit area
Retention legs option
Press-fit designed to fit 1.02mm diameter hole, solder-to board product
Meets DIN 41651 specification, HE13 and BT D2632

Reflow compatible
Cater to a wide range of applications
Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
Can be used for wire wrapping
Allows cleaning to remove soldering contamination
Cost-efficient
Easy pin insertion onto PCB
High retention force onto PCB
Same layout on THT and press-fit
Qualified product