A temperature compensation type chip MLCC has little change in capacitance by a change in temperature, so it is used for matching in filters and high frequency circuits. Component size reduction and higher mounting density are needed in wireless communications devices to support multi-band/multi-mode and increased diversity of functions. This product contributes to smaller and higher density circuit design by reducing the size of a 11pFto100pF temperature compensation type chip MLCC from the former smallest 01005 size (0.4mm x 0.2mm) to the 008004 size.


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