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Samtec ExaMAX® High-Speed Backlane Systems

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ExaMAX® high speed & micro backplane systems

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Increasing data rates, denser systems and shrinking product footprints challenge designers to meet their systems’ high-speed interconnect needs. Samtec provides engineers the service, products, tools and resources to optimise the entire system signal chain from the backplane to the front panel.

ExaMAX® high-speed backplane systems deliver 28 Gbps of electrical performance while offering an easy migration path to 56 Gbps. A choice of 28 Gbps performance on a 2.00 mm column pitch, or 56 Gbps performance on a 3.00 mm column pitch, gives designers the option of optimizing density or minimizing board layer count for high-speed backplane applications.

Samtec ExaMAX® High-Speed Backplane Systems

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Features and benefits

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Enables 28 Gbps electrical performance on 2.00 mm column pitch Exceeds OIF CEI-28G-LR specification for 28 Gbps standards Individual signal wafers in a staggered, differential pair design: 72-pair design: 6-pair x 12 column 40-pair design: 4-pair x 10 column	Wafer incorporates a one-piece embossed ground structure Increased isolation significantly reduces crosstalk Ground placement engineered for 92Ω option addresses both 85Ω and 100Ω applications Balanced differential pairs are arranged in columns with zero skew	Press-fit tails provide a reliable electrical connection between the connector and the board Blind mate capable with built-in macro and micro guidance modules that allow for selfcapture, self-alignment and mating without damage High power modules deliver bulk current to mating power components at 80 A per module