Samtec High-Speed Signalling Interconnect Solutions

Samtec’s range of high-speed board-to-board and backplane interconnect systems delivers exceptional signal integrity, supporting data rates of up to 112Gbps PAM4. The connector designs are engineered to minimize crosstalk and insertion loss, enabling reliable performance in dense, high-bandwidth applications. With scalable configurations, flexible stacking heights and proven reliability, Samtec board-to-board interconnects provide solutions for networking, high-performance computing and embedded systems.

To complement its board-to-board solutions, Samtec has developed a wide portfolio of high-speed cables and assemblies. The product range includes Twinax Flyover^® systems, which deliver low-loss links for data rates up to 112Gbps PAM4. By routing signals away from high-loss printed circuit boards, Flyover enables greater reach and design flexibility. Ideal for high-density applications, these assemblies support the latest architectures in data centres, AI platforms, and high-speed networking environments.

For even greater performance, Samtec’s mid-board optical solutions are designed to complement traditional copper-based connectivity in delivering data transmission with minimal signal loss over long distances. Mid-board connectivity places optical engines close to the data source, reducing latency and power consumption while further minimising losses generated over long PCB traces. Ideal for HPC, data centre, and AI systems, these technologies support data rates between 56Gbps and 112Gbps while simplifying thermal management and layout complexity.

With a combination of board-to-board, cable and mid-board solutions, Samtec is uniquely placed to deliver connectivity for the next generation of high-speed applications.