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COM-HPC® interconnect solutions

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Samtec offers a high-density interconnect system that meets the COM-HPC® standard for high-performance CoMs. COM-HPC meets the growing demands for server-grade performance at the edge providing extended connectivity and limitless scalability.

COM-HPC® provides system and interface flexibility by adopting a pair of 400 pin connectors (800 pins total) based on Samtec's AcceleRate® HP High-Performance Arrays. Samtec COM-HPC®-aligned connectors support existing and future interfaces such as PCIe® 5.0 (32 Gbps) and up to 100 Gb Ethernet.

The female Module Receptables are employed at a standard height. The male Carrier Plugs vary to allow for either a 5 mm or 10 mm stack height.

Depending on the application, the connector pinouts are optimized for Client or Server module as defined in the COM-HPC® specification.

Samtec offers a high-density interconnect system that meets the COM-HPC® standard for high-performance CoMs.
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Features/Applications

COM-HPC interconnect solutions - Features and Applications - Table
Features Applications
  • High-performance, flexible open-pin-field array
  • High-speed PCIe® 5.0 and 100Gb Ethernet capable
  • 400 pin BGA mount
  • 4 rows x 100 columns
  • 2.2mm/2.4mm/2.2mm row pitch
  • 0.635mm pitch
  • 5mm or 10mm stack heights
  • Dimensions: 68.62mm x 9mm x stack height
  • Up to 360 W at 11.4 Volts –12.6 Volts
  • Datacom & telecom
  • Embedded edge servers
  • Industrial
  • Medical imaging
  • 5G wireless infrastructure
  • 5G connected vehicles
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