SI-FLY™ HD on-package or ASIC adjacent cable system

Si-Fly™ is Samtec’s lowest profile Flyover® cable solution capable of residing next to the chip or direct on the substrate.

The extremely low 3.8mm profile allows Si-Fly™ to be placed adjacent to the IC package and under heat sinks or other cooling hardware for design flexibility. The high-density 8 or 16 pair configurations offer optimal solutions for routing 4 or 8 channels at 112Gbps PAM4 data rates and are PCIe® 6.0 capable.

Artificial Intelligence and Machine Learning technologies are driving new system architectures that demand increased speeds, bandwidths, frequencies and densities, along with scalability and configurability. Samtec offers innovative connectivity solutions with small form factors, extreme data rates and density, and signal integrity optimized performance – ideal for meeting the challenges of next generation AI/ML applications.

Samtec's extensive line of high-performance interconnect systems are ideal for AI & ML applications, providing benefits ,including thermal efficiencies, small form factors, extreme data rates and density, and signal integrity optimized performance.