The industry is experiencing a transformative shift from legacy, siloed systems toward digitalization and edge-to-cloud integration. Zettabytes of data from sensors and endpoints, and the advent of AI will drive the need for high-performance, industrial-focused memory and storage solutions as data is hosted and managed closer to the source. Micron leverages decades of experience in industrial applications to provide reliable, high-speed, low-power memory and robust embedded storage solutions for a broad range of markets from robotics, factory automation, medical, video security and smart infrastructure.
- DRAM & DRAM Modules
- Low Power DRAM
- Managed NAND e.MMC & UFS
- Storage SSD & uSD
- NOR Flash
DRAM components and modules are at the heart of industrial PCs and compute-intensive platforms. Micron offers leading-edge DRAM technology and a broad range of densities and speeds, all with a quality mindset.
DRAM components
- Broad density and packages for DDR2, DDR3, DDR4, DDR5
- Bus Width: x8, x16
- Packages: TSOP, BGA, VFBGA, FBGA
- Speeds up to 7200 MT/s (Y52K)
- Temperature ranges: 0°C to 95°C (CT), -40°C to +95°C (IT)
DRAM Modules
- Density ranges from 2GB to 256GB
- Bus Width: x64, x72, x80
- Form Factors: SODIMM, RDIMM, UDIMM, LRDIMM, VLP UDIMM, VLP RDIMM
- Available with ECC
AI-accelerated chipsets and systems crave high performance and low latency operation with increasing size of datasets. Low Power DRAM are critical to these solutions as they deliver high speed as well as low power characteristics. Micron was first to market with LPDDR5 and continues to lead in technology and solutions that cater to the most demanding AI-enabled, embedded solutions.
LPDDR4/4x
- Densities: 4Gb, 8Gb, 12Gb, 16Gb, 24Gb, 32Gb, 48Gb, 64Gb, 96Gb, 128Gb
- Bus Width: x16, x32, x64
- Packages: 200b, 432b, 556b
- Speed: 3.7Gbps, 4.2Gbps
- Temperature: -40°C to +95°C (IT), -25°C to +85°C (WT)
LPDDR5/5x
- Densities: 16Gb, 24Gb, 32Gb, 48Gb, 64Gb, 96Gb, 128Gb
- Bus Width: x16, x32, x64
- Packages: 315b, 441b, 496b, 561b, 563b
- Speed: 6.4Gbps, 7.5Gbps, 8.5Gbps
- Temperature: -40°C to +95°C (IT), -25°C to +85°C (WT)
Offering code and data storage for countless embedded solutions, managed NAND devices offer versatility and robustness with intelligent error correction code (ECC) and data management systems built-in. Micron’s 3D TLC NAND-based e.MMC and UFS solutions are ideal for fast boot for code and high sequential read/write and random read/write features. These devices are tuned for heavy database operations and support various Operating Systems such as Linux and Android OS.
e.MMC
- Technology: 3D TLC NAND
- Capacity: 32GB to 256GB
- Firmware: e.MMC Specification, JESD84-B51
- Operating Temperature (Tcase): IT = -40°C to +95°C
- Performance: Seq. Write: up to 240 MB/s, Seq. Read: up to 330 MB/s
- Dual voltage IO support
- Package: LFBGA153 (11.5x13x1.3mm)
UFS
- UFS Specifications: JESD220C 2.1, JESD220D 3.1
- Capacity: 32GB to 256GB
- Operating Temperatures (Tcase): Grade 3 (-40°C to +95°C) – AIT
- Package/Pinout: 153B TFBGA 11.5x13
Vast amounts of aggregated data will need to be stored at endpoints and edge-of-the-network systems so reliable, high performance storage will be critical. Micron offers a broad range of data storage solutions from micro SD cards that are tuned for video security, to component and M.2 embedded SSDs utilizing the latest 3D NAND technology to offer a wide range of capacities and form factors.
Embedded SSD (2100AI)
- Interface: PCIe Gen3 x4
- Packages: BGA (16mmx20mm) and M.2 2230
- Capacity: 64GB/128GB/256GB/512GB/1TB in BGA form factor
- Operating Temperature (Tcase) – -40°C to +95°C
- Encryption: 256-bit AES Encryption – TCG Opal 2.0
Memory card microSD (i400)
- SD speed class: UHS-I C10, U1/U3, A1/A2
- Form Factor: microSD UHS-I
- Capacity: 64GB to 1.5TB
- Up to 100MB/s (Read), 35MB/s (Write)
- Operating temperature: -25°C to +85°C
- Card Management: Health status monitor, field firmware update
Network Storage SSD (7450 Family)
- Interface: PCIe Gen 4x4
- Form Factor(s): U.3 15mm, M.2 22x80 and 22x110, E1.S 5.9mm & 15mm
- Capacity: 400GB up to 15.36TB
- FIPS 140-3 Level 2 and TAA compliant for US federal government procurement requirements
- SED, Non-SED and Microsoft eDrive options tailor security to deployment requirements
Industrial systems are expected to function with high reliability and ‘instant on’ performance. NOR flash technologies have come a long way to offer a robust solution for boot-up and designed-in features related to write and erase protection. Micron’s portfolio of NOR solutions offers high-quality, high reliability and execute-in-place capabilities backed by product longevity programs and Micron’s years of expertise in flash memory technologies.
Xccela™ NOR
- Technology: Single Level Cell - 45nm
- Speed: 3.0V: 133MHz (STR/DDR), 1.8V: 200MHz (DDR with DQS)/ 166MHz (STR), 73.25 ns latency (XiP mode, 32-byte aligned reads)
- Voltages: 1.8V (1.7V – 2.0V), 3.0V (2.7V - 3.6V)
- I/O Bus Width: x1, x8
- Temperature Range: Industrial -40°C to 85°C (IT)
- Available Packages: TBGA24, x1/ x8 Boot
SPI NOR
- Technology: Single Level Cell - 45nm
- Speed: 1.8V: 166MHz(90MHz DTR), 3.0V: 133MHz(90MHz DTR)
- Voltage: 1.8V (1.7V – 2.0V), 3.0V (2.7V - 3.6V)
- I/O Bus Width: MT25Q x1/x2/x4, MT25T x1/x2/x4 and Twin Quad 2(x4) =x8
- Temperature Range: Industrial -40°C to 85°C (IT)
- Available Packages: TPBGA24, SO16W, SO8W, DFN 6x5, DFN 6x8, WLCSP
Parallel NOR
- Density: 128Mb to 2Gb
- Technology: Single Level Cell - 45nm
- Access Time: 105ns Asynchronous
- I/O Bus Width: MT28EW - x8/x16, MT28FW - x16
- Temperature Range: Industrial -40°C to 85°C (IT)
- Available Packages: TSOP56 14x20mm, Fortified LBGA64 11x13mm
Giveaway
Industrial grade microSD card from Micron
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