Murata connectivity modules
Murata connectivity modules are designed to simplify wireless development and certification by minimizing the amount of RF expertise you need to wirelessly enable a wide range of applications.
- The latest standards-based products to enable the Internet of Things, smart applications, and M2M
- Broad range of modules for MCU, MPU and hostless applications
- Variety of form factors, antenna configurations, and power options to suit any consumer, commercial or industrial need
Type 2AE W-LAN+Bluetooth Combo Module
Type 2AE is a small and very high performance module based on Infineon CYW4373E combo chipset which supports Wi-Fi® 802.11a/b/g/n/ac + Bluetooth® 5.2 BR/EDR/LE up to 433Mbps PHY data rate on Wi-fi® and 3Mbps PHY data rate on Bluetooth®. The WLAN section supports SDIO v3.0 DDR50 interface and the Bluetooth® section supports high-speed 4-wire UART interface and PCM for audio data. Both WLAN and Bluetooth® section support USB2.0 interface too.
Features/Benefits
- Supports 802.11 a/b/g/n/ac 1x1 433Mbps
- NXP i.MX Linux and FreeRTOS, Infineon WICEDChipset: Infineon (CYW4373E)
- Common USB Hub between Wi-Fi and BT eliminates external USB Hub IC
- On-chip power amplifiers and low-noise amplifiers for both bands
- Programmable dynamic power management
- FCC/IC "Reference" Certified
Features/Applications
Product name | Description | Features | Applications |
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Wi-Fi® Modules / Wi-Fi®+Bluetooth® Modules | Wi-Fi® + Bluetooth® allow you to connect to internet directly, so it is the most flexible wireless technology for your IoT products. |
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UWB Modules | Ultra Wide Band (UWB) technology is good for secure and precise distance measurement which is based on Time of Flight (ToF) of radio waves. |
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LPWA Communication Modules | Low Power Wide Area (LPWA) network is a wireless communication technology specialized for interconnecting devices together, focusing on power efficiency and long range. Murata has formed strategic partnerships with market leaders, and is accelerating the development of products using this technology. |
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