AEC-Q101 qualified photocouplers
Toshiba offers a new generation of AEC-Q101 qualified photocouplers compliant to the requirements of most automotive applications with more than 20 years of experience in the automotive photocouplers market, Toshiba provides suitable products for the increasing isolation requirements in today’s automotive applications.

Features
- Wide range of AEC-Q qualified couplers with extended temp ranges from -40°C to + 125°C
- Extensive range of data rate options up to 20 Mbps
- Optical isolation with guaranteed internal galvanic isolation distance of 0.4mm
- Leading edge technology for highest reliable and lowest power consumption
- Packages with clearance and creepage distance of 5mm
Advantages
- Products are perfectly applicable for hard automotive environments
- Free choice of speed options for various communication standards
- Provides best in class isolation performance
- Enables highest system performance and efficiency
- Packages meet the required safety standards
Benefits
- Attractive cost effects
- High reliability of end products reduces cost of operation failures
- Ability to reduce bill of material costs due to most effective solutions
- Customers can save money through design and space optimization
- Smart performance increases
- Reduction of end-product size leads to a unique selling proposition for the customer
- Easy design for best performance
Photocoupler products
Photorelay | Part number / Description | Features | Datasheet / Diagram | Shop |
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TLX9175JPhotorelay SSR DC-Input 15mAThe Toshiba TLX9175J consists of an infrared LED optically coupled to a photo-MOSFET in a SO6 package. This coupler uses high voltage MOSFET between output terminals. It adequate for the applications of Battery Control Systems. |
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Datasheet Pin configuration |
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TLX9160TPhotorelay 30mA 1.8V DC-IN 50maThe Toshiba TLX9160T consists of an infrared emitting diode optically coupled to a photo-MOSFET in a SO16L-T package. This coupler uses high voltage MOSFET between output terminals. It adequate for the automotive control applications with a battery voltage of 1000V or less in an environment with a pollution degree 2 since the creepage distance on the detector side is 5mm or more. |
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Datasheet Pin configuration |
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IC Output | Part number / Description | Features | Datasheet / Diagram | Shop |
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TLX93095-Pin Surface MountThe TLX9309 consists of a high-output light emitting diode optically coupled to a high-speed detector, which consists of a photodiode and a transistor integrated on a single chip. Additionally having a faraday shield integrated on the photodetector chip provides an enhanced common-mode transient immunity. |
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Datasheet Pin configuration |
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Photovoltaic Output | Part number / Description | Features | Datasheet / Diagram | Diagram |
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TLX9905Photovoltaic DC-Input 1-Channel Automotive 4-Pin SOThe TLX9905 is a photocoupler in the SO6 package that consists of an infrared light emitting diode optically coupled to a photodiode array. The photodiodes are connected in series, making the TLX9905 suitable for MOS gate drive applications. |
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Datasheet Pin configuration |
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Transistor Output | Part number / Description | Features | Datasheet / Diagram | Shop |
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TLX9300Transistor-Output 3750Vrms 4-Pin Surface MountThe TOSHIBA TLX9300 mini-flat photocoupler is suitable for surface-mount assembly. The TLX9300 consists of an infrared LED optically coupled to a photo-transistor. |
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Datasheet Pin configuration |
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Power MOSFETs
Toshiba offers an extensive lineup of power MOSFETs for various automotive applications including 48V battery systems. The combination of low ON-resistance and advanced package technology makes Toshiba's power MOSFETs an ideal solution for reducing system losses, thereby contributing to energy-saving in automotive applications. All MOSFETs featured here are qualified to AEC-Q101 or are under AEC-Q101 qualification.
Copper (Cu) connector bonding
Copper(Cu) connectors are used instead of conventional Aluminum wire bonding in all the MOSFETs mentioned in this flyer. Copper connectors contribute to the reduction of the package resistance and inductance.

Double-sided cooling
The DSOP advance(WF) double-sided cooling packages fit the same footprint as the SOP advance(WF). Due to the greatly reduced thermal resistance, the maximum load can be increased considerably. Alternatively, the MOSFET temperature can be reduced to increase long term reliability.

MOSFETs products
DPAK+ | Part number / Description | Features | Applications | Shop |
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TK55S10N1,LXHQTransistor MOSFET N-Channel 100V 55A 3-Pin DPAKDatasheet |
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DSOP Advance | Part number / Description | Features | Applications | Shop |
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XPW6R30ANB,L1XHQTransistor MOSFET N-Channel 100V 45A 8-Pin DSOP AdvanceDatasheet |
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SOP Advantage | Part number / Description | Features | Applications | Shop |
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XPH4R10ANB,L1XHQTransistor MOSFET N-Channel 100V 70A 8-Pin SOPDatasheet |
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TSON Advance | Part number / Description | Features | Applications | Shop |
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XPN3R804NC,L1XHQTransistor MOSFET N-Channel 40V 40A 8-Pin TSON AdvanceDatasheet |
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