The transportation industry like many others, is in a constant state of transformation from advanced driver assistance (ADAS) to electrification, multiple levels of autonomy and centralized architectures. These systems can produce massive amounts of data that must be stored in rugged memory. Micron leverages decades of experience to provide innovative, reliable, high-speed memory solutions for applications both inside and outside the cockpit.
- LPDDR
- UFS / e.MMC
- NOR FLASH
- SSD
Designed for optimal performance, low power consumption and the lowest latency, the Micron automotive Low Power DRAM portfolio has been optimized to the industry’s most demanding applications. Micron continues to innovate, introducing the industry’s first ASIL-D ISO 26262 certified LPDDR5/X. Micron has gone on to develop a full portfolio of ASIL-D compliant LPDDR4X and LPDDR5X components – enabling the next generation of ADAS and safety applications.
LPDDR5/5x
- ASIL-D ISO 26262 certified
- Bus Width: x64 (4Chx16), x32 (2Chx16)
- Package: 441b BGA 14.0mm x 14.0mm, 315b BGA 12.4mm x 15.0mm
- Speed: 6.4Gbps / -031 LP5, 7.5Gbps / -026 LP5x (All except Y31M), 8.5Gbps / -023 LP5x
- Temperature: -40°C to +125°C (AUT), -40°C to +105°C (AAT), -40°C to +95°C (AIT)
Consumers expect the cockpit to be a natural and integrated extension of their digital lifestyle. This demands latest technologies that operate at state-of-the art speeds supporting highest display resolutions without lag. There is an equal expectation to introduce unique end experiences such as anticipating the driver or passenger’s mood, surroundings, state of mind, biometrics, while accessing their calendar of events and through AI to develop a unique and tuned holistic experience in the vehicle accordingly. State of the art, auto qualified storage – including UFS and e.MMC prove essential in addressing this very demanding application space.
UFS
- Technology: v2.1: 64T 3D TLC NAND, v3.1: 96T 3D TLC NAND, v3.1: 176T 3D TLC NAND
- UFS Specifications: JESD220C 2.1, JESD220D 3.1
- Operating Temperatures (Tcase): Grade 2 (-40°C to +105°C) – AAT, (-40°C to +115°C), Grade 3 (-40°C to +95°C) – AIT
- Package/Pinout: 153B TFBGA 11.5x13x1.2mm, SAC302, JEDEC, 153B TFBGA 11.5x13x1.2mm, SAC302, JEDEC-5Vss, 153 LFBGA 11.5x13x1.3mm SACQ, JEDEC-5Vss, 153 LFBGA 11.5x13x1.3mm SACQ, JEDEC-5Vss
eMMC 5.1
- Technology: 3D NAND 32T 2b/c (MLC), 3D NAND 64T 3b/c (TLC), 3D NAND 176T 3b/c (TLC)
- Firmware: e.MMC 5.1 Specification, JESD84-B51
- Operating Temperature (Tcase): Grade 2 (-40°C to +115°C) AAT, Grade 3 (-40°C to +95°C) AIT
- Performance: Seq. Write: up to 120 MB/s, Seq. Read: up to 320 MB/s
- Packages: LFBGA153 (11.5x13x1.3mm), VFBGA153 (11.5x13x0.9mm), WFBGA153 (11.5x13x0.8mm)
Automotive memory must function in extreme environments with “instant on” performance. Our NOR FLASH memory offers a high-quality, small-footprint package with execute in place capabilities that demand the highest reliability with lightning-fast boot times.
Combined with Authenta, the industry’s only and innovative security-as-a-service platform, Micron offers the most robust, secure automotive FLASH solutions.
Xccela NOR
- Technology: Single Level Cell - 45nm
- Speed: 3.0V: 133MHz (STR/DTR), 1.8V: 200MHz (DDR with DQS)/ 166MHz (STR), 73.25 ns latency (XiP mode, 32-byte aligned reads)
- Voltages: 1.8V (1.7V – 2.0V), 3.0V (2.7V - 3.6V)
- I/O Bus Width: x1, x8
- Temperature Range: Automotive grade: -40˚C to +105˚C (AT), -40˚C to +125˚C (UT)
- Available Packages: TBGA24, x1/ x8 Boot
- AEC Q100 compliant
SPI NOR
- Authenta - Security as a Service Platform
- Technology: Single Level Cell - 45nm
- Speed: 1.8V: 166MHz(90MHz DTR), 3.0V: 133MHz(90MHz DTR)
- Voltage: 1.8V (1.7V – 2.0V), 3.0V (2.7V - 3.6V)
- I/O Bus Width: MT25Q x1/x2/x4, MT25T x1/x2/x4 and Twin Quad 2(x4) =x8
- Temperature Range: Automotive grade: -40˚C to +105˚C (AT), -40˚C to +125˚C (UT)
- Available Packages: DFN 6x5, SO8W, SO16W, TPBGA24, 1CLK/1CE and 2CLK/2CE configurations
- AEC Q100 compliant
Parallel NOR
- Technology: Single Level Cell - 45nm
- Access Time: 105ns Asynchronous
- I/O Bus Width: MT28EW - x8/x16, MT28FW - x16
- Temperature Range: Automotive Grade (-40˚C to +105˚C)
- Temperature Range: Automotive grade: -40˚C to +105˚C (AT), -40˚C to +125˚C (UT)
- Available Packages: TSOP56 14x20mm, LBGA64 11x13mm
- AEC Q100 compliant
For automotive solutions and heavy equipment to fleet management in trucks, it is clear that these markets need to be designed with application-tailored reliability, quality, performance, security and longevity in mind. You can get reliable performance for a variety of conditions with Micron’s automotive and industrial SSDs. These SSDs deliver high capacities, up to automotive temperature options and give systems designers the flexibility they need.
4150AT SSD
World’s first quad-port, SR-IOV automotive SSD built for enterprise-grade performance with longevity, reliability, quality, ruggedness and application-specific features.
- Configurable multiport (single, dual, triple and quad)
- SR-IOV allows for shared and private namespaces
- Design flexibility to match system usage models with TLC, SLC and HE-SLC endurance modes
- Read/write performance up to 600K/100K IOPS respectively
- -40 C to 115 C Tc operating temperature range
- Fast boot with TTR <100ms
- Automotive qualified, ASIL-B and ASPICE level 3
2100AI/AT SSD
Boost performance and reliability of leading-edge automotive electronics systems and industrial-grade applications with Micron's new line of 2100AI/AT SSDs.
- NVME 1.3c 64 GB to 1 TB densities
- Sequential Reads 128K 2000 MB/s Sequential Writes 128K 1700 MB/s
- Operating Temperature (Tcase) AI = -40oC to +95oC, AT = -40oC to +105oC
- Packages: M.2 (22x30; 1.6mm from the top), BGA (16x20x1.2mm; 1.6mm for 1TB)
- 256-bit AES Encryption - TCG Opal 2.0
Micron’s Road-Tested Solutions for your Automotive Needs
With a more than 30-year commitment to the automotive industry and road-tested solutions that have logged trillions of miles, Micron delivers the automotive-qualified memory and storage you need.
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