Tflex SF4, Tflex SF7, and Tflex SF10
Silicone Free Thermal Gap Fillers
New from Laird is Tflex™ SF4, SF7, and SF10, three silicone-free gap fillers. These soft thermal transfer solutions offer superior thermal performance without overstressing boards and components. Featuring 4 W/mK, 7 W/mK, and 10 W/mK thermal conductivity, these gap fillers deliver exceptional deflection properties and extremely low thermal resistance.
Features and Benefits:
- Silicone free formulation
- Low peak and residual pressure
- Excellent surface wetting for low contact resistance
- Exceptionally low thermal resistance
- UL V-0 Flammability Rating
Applications:
- Datacom Systems
- Automotive Electronics
- Telecom Systems
- Optical Modules
- Cameras
Typical Properties
| Property | Tflex SF4 | Tflex SF7 | Tflex SF10 | Test Method |
|---|---|---|---|---|
| Color | Light Grey | Dark Grey | Grey | N/A |
| Thickness Range | 0.5mm-4mm | 0.5mm-4mm | 0.5mm-5mm | N/A |
| Thermal Conductivity (W/mK) | 4.0 | 7.8 | 10.0 | Hot Disk |
| Operating Temperature | -65 to 125°C | -65 to 125°C | -40 to 125°C | Laird Test Method |
| Density (g/cc) | 3.1 | 3.4 | 3.7 | Helium Pycnometer |
| Hardness (shore 00) 3 second/30 second |
1-4mm: 40/TBD 0.5-0.75mm: 70/TBD |
1-4mm: 40/TBD 0.5-0.75mm: 70/TBD |
1-5mm: 40/8 0.5-0.75mm: 70/50 |
ASTM D2240 |
| Outgassing TML (weight %) | TBD | TBD | 0.33 | ASTM E595 |
| Outgassing CVCM (weight %) | TBD | TBD | 0.15 | ASTM E595 |
| Thermal Resistance (°C in²/W) • 1.5mm, 30 PSI |
0.070 | 0.057 | 0.047 | ASTM D5470 |
| Dielectric Breakdown Voltage (kV/mm) | 7.5 | 7.9 | 7.5 | ASTM D149 |
| Dielectric Constant | TBD | TBD | 9 | ASTM D150 |
| Volume Resistivity | 6 × 10^13 | 5 × 10^13 | 10^14 | ASTM D257 |
*Thickness Tolerance is +/- 10%
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