PCIe signaling is a critical protocol used in the server and storage industries. As PCIe requirements advance, extending that signaling capability through the use of higher performing connectors and cable assemblies is required to enable the system to meet performance.
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SlimSAS Connectors
Delivering 12-, 16- and 24-Gbps data rates, SlimSAS Cable Assemblies meet SAS-3, SAS-4 and PCI Express 4 standards in a compact form factor for storage, mobile and enterprise industries.
- Meets SAS 4.0, 24 Gbps specifications: Meets next-generation industry standards.
- Low-profile cable assemblies available: Eases implementation in space-constrained applications. Increases airflow.
- Loose pair and ribbon cable design available: Offers flexible cable routing to meet application’s specific needs.
Direct Attach Cable (DAC) Assemblies
Molex High-Speed DAC Assemblies deliver a complete zSFP+ and zQSFP+ interconnect solution across multiple industry standards, with data rates as high as 100 Gbps and off-the-shelf and custom lengths.
- 10, 25, 28 and 40 Gbps with the capability of delivering 100+ Gbps: Delivers high-speed connection to meet today’s data rate needs.
- Optimized wire termination zone: Minimizes insertion loss and crosstalk.
- Function across a wide variety of next-generation technologies and applications: Enables connections between a range of applications.
QSFP-DD (Double Density) Interconnect System
QSFP-DD Interconnect System’s 8-lane electrical interface transmits up to 28 Gbps NRZ or 56 Gbps PAM-4, up to 200 or 400 Gbps aggregate, with the same footprint as QSFP Interconnects, making them backward compatible.
- 28 Gbps NRZ and 56 Gbps PAM4 Cable Assemblies
- Temp-Flex cable technology: Boosts electrical performance. Provides excellent operational margin, short lead times and minimal end-user cost via manufacturing efficiencies.
- 32 and 30 AWG cables: Fulfills all industry application needs at lengths up to 5.0m. Enhances cost structure and lead time.
- Fully integrated design: Incorporates all components (backshells, cable, populated PCBs) from Molex. Ensures high-quality components are compiled into a comprehensive solution with a superior cost structure.
zQSFP+ Integrated Product Solutions
Supporting 100 Gbps Ethernet and InfiniBand Enhanced Data Rate (EDR) applications, Molex’s zQSFP+ Interconnect System transmits up to 28 Gbps per-serial lane data rates, and offers thermal protection and TempFlex Cable Assemblies to ensure excellent signal integrity (SI) and prevent electromagnetic interference (EMI).
- 28 Gbps Temp-Flex Cable Assemblies (Series 100297)
- Temp-Flex cable technology: Boosts electrical performance. Provides excellent operational margin, short lead times and minimal end-user cost via manufacturing efficiencies.
- 32, 30 and 26 AWG cables: Fulfills all industry application needs at lengths up to 5m. Enhances cost structure and lead-time.
- Meets IEEE 802.3bj, InfiniBand EDR and SAS 3.0 specifications: Functions across a wide variety of nextgeneration technologies and applications.
SFP-DD (Double Density) System
SFP-DD (Double Density) Module and Cage/Connector System delivers a 2-lane electrical interface, complementing QSFP-DD top-of-the-rack interfaces, and addresses issues caused by underpopulated lanes in file server interconnects.
- Backward compatible with all SFP-style interfaces: Mates with existing SFP+ Cable Assemblies, Modules and AOCs. Same form factor as zSFP+ Connectors, except for depth (SFP+ = 49.00mm deep; SFP-DD = 71.50mm deep). The resulting 22.50mm increase in depth accommodates second row of terminals.
- Focused 2-lane interconnect at the server: Accommodates higher lane count QSFP-DD top-of-rack (TOR) interface. Takes up less board and panel real estate than do zQSFP Interconnects.
- Temp-Flex cable technology: Boosts electrical performance. Provides excellent operational margin, short lead times and minimal end-user cost via manufacturing efficiencies.
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Impel Backplane Solutions
Delivering industry-leading signal integrity and density while providing a scalable price and performance path for future data-rate enhancements, the Impel Backplane Connectors and Customized Cable Assemblies enable OEM equipment to operate at today’s data rates.
- Staggered header pin interface: Provides robust mechanical isolation from the signal pins. Mitigates the concern for bent pins in the field. Provides first-mate-last-break capabilities.
- Compact, compliant-pin backplane and daughtercard connectors with data rates scalable from 25 to 40 Gbps: Enables backward and forward compatibility with various high-end Copper and cable architectures.
- Impel Connector technology with tightly coupled differential-pair structure: Provides optimal signal integrity and mechanical isolation through the connector system.
Impulse Backplane Connector System
Impulse Backplane Connector System and Cable Assemblies support data rates of 56 (NRZ) or 112 Gbps (PAM-4) with superior signal integrity, making them ideal for high-density applications.
- Supports data rates of 56 (NRZ) or 112 Gbps (PAM-4): Meets data speed requirements for switches and routers.
- U-shaped ground blades: Provides robust mechanical isolation between signal pins. Mitigate risk for bent pins in the field. Provide first-mate-last-break capabilities.
- Long mechanical mating wipe: Offers increased contact area for clean signal transmission and enhanced performance.
- Hermaphroditic signal beam design: Innovative signal interface improves insertion loss over traditional beams, pushing interface resonances far beyond 35 GHz. Lowers mating force.
NearStack PCIe Connector System
NearStack PCIe Connector System and Cable Jumper Assemblies use twinax cables to deliver a PCB alternative, and have been optimized for height, PCB density and robustness, while enabling implementation of PCIe Gen-5 32-Gbps data rates.
- Built with direct-to-contact twinax termination: Removes the PCB paddle card from the assembly, improving manufacturing efficiencies, repeatability, and signal integrity.
- Unique contact interface with flexing beams on NearStack cable receptacle: Affords no chance for preloaded beam relaxation through reflow. Has less potential for damage to hard-to-rework PCB side. Offers reduced stub lengths compared to traditional cantilever on PCB pad.
- Low profile solution: Provides a mated height of 11.10mm (R/A cable) to reduce airflow interference and allow for placement in tighter spaces within the system.
Sliver Edge Card Connectors
The versatile Sliver Edge-Card Receptacle, recognized by the Small Form Factor Committee (SFF), Open Compute Project (OCP) and Gen-Z Consortium standards, offers various configurations for effective use in a wide variety of high-speed board-to-board, copper flex and cable applications.
- A versatile connector for use across multiple platforms: Adaptable for memory/storage, accessory cards and orthogonal direct configurations. Enables large-volume purchases for a variety of applications.
- Small 0.60mm pitch: Offers a 30% space savings compared to a conventional 0.80mm-pitch solution.
- Custom cable assemblies available: Simplified procurement by enabling the cable assembly to be purchased from the same vendor as the connector.
PCI Express PCI-X Connectors
PCI Express is a third generation I/O architecture. PCI-SIG* recently revised the PCI Express specifications from version 1.1 to version 2.0. This revision doubles the PCI Express interconnect bit rate from 2.5 GT/s (gigatransfer per second) to 5 GT/s per lane. Unlike the previous version, in which the PCI bus was implemented via multi-drop parallel architecture, the PCI Express incorporates a point-to-point signaling using differential pairs. A 16-lane link now could provide approximately 16 Gbps of data-transfer. With this increase in signaling speed, the PCI Express now provides better support to high-bandwidth applications. It is also backward compatible with current PCI Express 1.1 version products.
Features
- High-temperature thermoplastic housing
- Complies with PCI-SIG industry specifications
- Keying design allows only one mating orientation
- Hot Plugging Benefits
Benefits
- Withstands lead-free processing
- Allows connectors to support all PCI Express module cards available in the market.
- Ensures correct mating of card module to edge card connector.
- Allows for insertion and removal of card without system shut down, facilitates connection in cramped spaces.
Chuck Crandley - state of PCIe technology in server designs and next generation technology LISTEN NOW
Alexandra Haser - PCIe, SAS, IEEE and SFF; defining a path towards next-gen technology LISTEN NOW
Bill Wilson - new high-speed internal cable assemblies for server storage markets LISTEN NOW
Connector-System Density and Signal Integrity - keys to PCIe 5 Success
Steady growth in datacenter infrastructure investment is also driving considerable growth in PCI Express (PCIe) with an expected increase in CAGR of 20.6% by 2026. Download this whitepaper to learn more.
CONNECTOR-SYSTEM DENSITY AND SIGNAL INTEGRITY HOLD KEYS TO PCIe 5 SUCCESS
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