New Products - Amphenol

NPI Body

AgilLink/AgilBrick

AgilLink: 0.8mm pitch~3.96mm pitch

AgilBrick: 1.27mm pitch~2.54mm pitch

AgilLink™ wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 3A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length, latch or location post, which makes it an ideal choice for several applications and specific designs.

AgilBrick™ Board-to-Board Header Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs. These headers also make it easier to choose from different board mounting configurations as it supports various mounting options including vertical DIP, right angle DIP, vertical SMT and right angle SMT.

Features

0.8mm pitch~3.96mm pitch
Current rating: 1~4A
Variety of mating option
Comprehensive types

Applications

low signal transmission/ low power transmission/ can connect MB to Card or Card to Card

Key Components

Signal Pin/ low power pin/Lock structure

Benefits

AgilLink: Saving space/Snap-in mating/Lock function for ensures alignment during mating
AgilBrick: High flexibility in customization/Support PIP process/Suitable to WTB application