Hero Banner

New Products - Transcend

NPI Body

Bluetooth 6.0 Meets MTE712P SSD

Powering Ambient Invisible Intelligence at the Edge

Samtec-ULTRA MICRO INTERCONNECTS

Ultra-fast storage and next-gen wireless technology drive seamless, intelligent, and invisible edge computing.

Combining Bluetooth 6.0 with Transcend’s MTE712P SSD empowers edge AI devices with ultra-reliable data storage and low-latency communication for real-time, ambient intelligence.

As edge computing becomes the foundation of AI-enabled smart environments, the fusion of Bluetooth 6.0 and Transcend’s MTE712P PCIe Gen4x4 SSD introduces a new paradigm: Ambient Invisible Intelligence. This concept refers to intelligent systems that operate seamlessly and imperceptibly in the background, enabling real-time data exchange and decision-making with minimal latency and maximum efficiency.

Bluetooth 6.0 brings enhanced range, ultra-low power consumption, and improved bandwidth, making it perfect for edge devices in smart factories, healthcare, and intelligent transport systems. Coupled with the compact, durable, and high-performance MTE712P SSD, these systems gain the ability to process and store massive data loads securely and reliably—even in harsh environments.

 

Features

  • PCIe Gen4 x 4 interface for ultra-fast data transmission
  • Built-in Power Loss Protection (PLP) for data integrity
  • AES 256-bit hardware encryption and TCG Opal 2.0 compliance for data security
  • Wide temperature support (-40°C to 85°C) with Corner Bond and anti-sulfur protection
  • Built-in DRAM cache for better endurance and real-time performance

 

Applications

  • Smart healthcare: Edge AI devices for diagnostics, monitoring, and treatment
  • Industrial IoT (IIoT): Intelligent sensor networks in automation and robotics
  • Smart cities: Traffic control, public safety, and infrastructure monitoring
  • Wearables & mobile computing: Power-efficient devices with robust storage
  • Smart logistics: Real-time asset tracking with high-speed, secure data capture

 

Key components 

  • 112-layer 3D NAND Flash
  • DDR4 DRAM cache
  • PCIe Gen4 x 4 NVMe interface
  • PLP, Power Loss Protection
  • 30µ" PCB gold finger
  • Corner Bond and anti-sulfur protection
  • AES encryption & TCG Opal compliance

 

Benefits

  • Invisible, ambient operation with real-time AI decision-making
  • Reliable performance in mobile, harsh, or temperature-sensitive environments
  • Secure data storage and transfer for mission-critical applications
  • Compact M.2 form factor for space-constrained designs

 

Body Content Spots
Supplier Logo
Content Spots

More inforamtion

 

Newsletter

Subscribe for Online Delivery

SIGNUP