Micron LPDDR4/LPDDR4X SDRAM

LPDDR are DRAM devices optimized specifically to address the power consumption issues in battery-operated applications. It was originally developed for handsets and ultra-portables.​

Some of the reasons you would use LPDDR over other options are:

• Performance: peak bandwidth 33% faster compared to DDR4
• Optimization: x32 configuration offers BOM savings for certain low density applications
• Power Consumption: 5 times lower power consumption in standby mode compared to standard DRAM
• Space, form factor, weight: MCP (Multi chip package) and PoP (package-on-package) designs save PCB Space

Key features

• Densities: 4 Gb to 128 Gb - Provides flexibility for a variety of applications
• Configurations: x16, x32, x64 - Enables fewer components to support wide bus architect.
• Core voltages: 0.6 V, 1.1 V - Helps reduce power consumption
• Temperature ranges: –40 ˚C to +95 ˚C IT, –40 ˚C to +105 ˚C AT, –40 ˚C to +125 ˚C UT

Additional features

• Configurations: x32, (2 channels, x16), x64 (4 channels, x16) - Enables the use of fewer components to support wide bus architectures.
• Core voltages: 0.6 V, 1.1 V - Helps reduce power consumption, a key advantage over standard DRAM.
• Clock frequencies: up to 2133 MHz - Provides high performance, high bandwidth, and low power consumption.
• Power consumption - Delivers low power consumption in standby and active modes, plus special mobile features to reduce power for a more efficient design (refer to datasheet for details).
   

Special features:

• Temperature-compensated self-refresh (TCSR) - Adjusts refresh timing to minimize power consumption at lower, ambient temperatures
• Partial-array self-refresh (PASR) - Reduces power by refreshing only critical data
• Deep power-down (DPD) - Provides an ultra-low power state when data retention is not required
• Programmable drive strength (DS) - Enables adjustment for operation in point-to-point and point-to-2-point applications
• Programmable VOH signal level - Enables adjustment for operation in point-to-point and point-to-2-point applications
• Temperature ranges - Enables high performance in extreme environments: -40 ˚C to +95 ˚C (IT) -40 ˚C to +105 ˚C (AT) -40 ˚C to +125 ˚C (UT Ultra2)
• Packages PoP - Saves board space by enabling a Mobile LPDRAM to be stacked on top of a processor so that the two components require only one footprint on the board
• Known good die (KGD) - Supports bare die with edge bond pads for easy stacking in SIP and MCP solutions
• FBGA - Supports JEDEC-standard FBGA ballout

Applications

• Automotive – Infotainment, ADAS, communications, clusters
• Industrial – POS/Retail
• Consumer – AR/VR, home automation, DSC/DVCs
• Networking – Machine-to-Machine (M2M) devices, USB dongles
• Security – Fingerprint detectors, digital surveillance
• Client – Notebooks, ultrathins, convertibles, detachables
• Graphics – Portable games
• Medical - Patient monitor, defibrillator, Ptbl ultrasound