New Product Introduction

NPI Body

Infineon Technologies AIROC™ CYW20820

Bluetooth® & Bluetooth® LE system on chip

The AIROC™ CYW20820 dual mode Bluetooth^® system on chip is core spec compliant to 5.2, along with high-performance compute capability integrating an Arm^® Cortex^®-M4 processor with floating point unit. It is a highly integrated device with high transmit power and embedded flash along with multiple serial interfaces, PWMs, and more.

The CYW20820 SoC provides reliable Bluetooth^® and Bluetooth^® LE connectivity and is 5.2 core spec compliant. With an integrated Arm^® Cortex^®-M4 processor with a floating point unit, the CYW20820 SoC offers high performance compute suitable for a variety of applications.

Key features

Core spec 5.2 complaint with 96-MHz Arm^® Cortex^®-M4 MCU and LE-2 Mbps support.
Programmable Tx power up to 11.5dBm Tx power and -94.0 dBm Rx sensitivity
Infineon branded modules are certified with global regulatory bodies
Integrated flash, analog and digital components allowing easy external component interfaci

Additional features

Reliable, long - range Bluetooth^® LE Connectivity
Reduction in dropped packets during transmission, thereby improving customer experience
Reduced development costs and faster time to market with fully certified modules
Reduced BOM and faster time to develop with external sensors