| Area |
Parameter |
K24 |
| Form Factor |
Dimensions (with thermal enclosure) |
60 mm x 42 mm x 11 mm |
| Processor Unit & Acceleration |
Application Processor |
Quad-core Arm® Cortex®-A53 MPCore™ at 1.33 GHz |
| Real-Time Processor |
Dual-core Arm Cortex-R5F MPCore at 553MHz |
| Graphics Processing Unit |
Arm Mali™-400 MP2 at 600 MHz |
| Deep Learning Processor Unit (DPU) |
INT8 (852 GOPs with B2304 DPU) |
| Trusted Platform Module (TPM) |
Infineon 2.0 |
| Memory |
On-Chip* |
9.4 Mb on-chip SRAM |
| On-SOM |
2 GB, 32-bit LPDDR4 @ 1066 Mbps w/ ECC configuration** and 32 GB eMMC |
| Connectivity |
High-Speed PS Connectivity (GTR) |
PCIe® Gen2 x4, 2x USB3.0, SATA 3.1, DisplayPort, 4x tri-mode gigabit Ethernet |
| General PS Connectivity (MIO) |
2x USB 2.0, 2x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO |
| Transceivers |
GTR 6 Gbps Transceivers |
4 |
| I/O Count |
PS MIO (1.8V) |
49 |
| PL High-density (HD) I/O (3.3V) |
23 |
| PL High-performance (HP) I/O (1.8V) |
56 |
| Programmable Logic |
System Logic Cells (K) |
154 |
| DSP Slices |
360 |
| Power & Thermal |
Typical Power |
5W |
| Maximum Power*** |
10W |
| Thermal Interface |
Passive (clamshell thermal plates) |
| Speed and Temp Grade |
Commercial |
-2 speed grade, low voltage and 0 to 85°C temperature range |
| Industrial |
-2 speed grade, low voltage and –40 to 100°C temperature range |
*On-chip memory (Mb) = max. distributed RAM + total block RAM + UltraRAM
**K24 I-grade only supports ECC memory
***Estimated and subject to change based on actual hardware evaluation
RESOURCES
ebv content library/home/products/product-highlights/amd-kria-adaptive-motor-control-soms/kria-k24-som/ebv - amd - kria - k24 table static html
EBV - AMD - Kria - K24 Table Static HTML
