CoolSiC™ MOSFETs Generation 2
Empowering the next generation of high-performance systems
Explore how the new CoolSiC™ trench MOSFET G2 enables a new level of SiC performance, while meeting the highest quality standards in all common combinations of power schemes: AC-DC, DC-DC and DC-AC. Photovoltaic inverters, energy storage systems, EV charging, power supplies, motor drives and more belong to the many cases where SiC MOSFETs provide additional performance, compared to Si alternatives.
Features
- 650 V / 1200 V CoolSiC™ MOSFET G2
- Lowest available RDS(on)
- Largest product portfolio
- Unique robustness features
Potential applications
- EV charging
- Solar
- UPS
- Drives
- Datacenter and telecom power, industrial SMPS
- Renewables
- Consumer applications (White Goods, TV, Air conditioning, Heat pumps)
Striving for excellence in SiC MOSFETs by trench technology
CoolSiC™ Generation 1 |
CoolSiC™ Generation 2 |
Established the benchmark in efficient power conversion |
Securing price-performance leap |
Solved the gate oxide reliability risk in SiC MOSFETs using a trench gate |
Maintaining G1 high reliability |
Overcame common SiC MOSFET limitations in control and drive |
Adding new robustness features for maximizing each $ invested in SiC-based power systems |
Made all industry-standard packages available |
Advancing the packaging technology for more powerful products |
>>> Reliable performance <<<
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>>> Unmatched industry leadership <<<
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Further advancement of Infineon´s unique .XT interconnection technology (e.g. in discrete housings TO-263-7, TO-247-4) serves to overcome the common challenge of improving semiconductor chip performance while maintaining its thermal capability. The thermal capability is now 12% better for the new generation, boosting the chip figures-of-merit to a new level of SiC performance.
Featured products
Videos
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EBV - Infineon - CoolSiC Gen 2 Intro Static HTML