Lumileds LUXEON FlipChip UV

Lumileds LUXEON FlipChip UV

LUXEON FlipChip UV is the smallest and highest power density (W/cm2) ultraviolet with FlipChip Technology in a Chip Scale Package (CSP) LED can be reflowed onto a substrate with a standard surface mount (SMT) equipment and process. LUXEON FlipChip UV LED enables tighter beam control and high packing density of LEDs on a chip-on-board solution and completely eliminates wire bonds in the system. LUXEON FlipChip UV is the ideal choice for cost sensitive applications to achieve high irradiance at high current density, maximizing W/$ by taking the advantage of lowest thermal resistance of a chip scale package device.

Features & benefits​​​

• Ultraviolet wavelength range of 380–410nm for a range of options
• Micro sized CSP: 1.0mm2 package for design flexibility and packing density
• No wire bonds allows for direct attach and reflow
• 5-sided emitter with batwing radiation pattern enables wide viewing angles
• Low thermal resistance for leading system level lm/$
• Maximum drive current of 1A for delivers superior lumens for reduced LED count