Octavo Systems delivers innovative high quality System-in-Package (SiP) solutions that can be used as common building blocks in your electronic design. The company focuses on creating products based on standardised systems that can be used in a wide variety of different applications, to simplify your design and speed up your time to market.
By creating SiP devices, Octavo allows the idea behind Moore’s law to continue, as the industry transitions from System on Chip (SoC) as the system integration method to System in Package (SiP) technology as the solution of choice. Through its technology and design innovations, Octavo is making this technology more accessible to all, allowing for the continued development of smaller, more cost effective, and more innovative products.
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