Teledyne e2v DDR4T04G72M

The 4GB / 8GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is an Ultra-High Density Memory Solution, targeting Space Embedded Systems & Applications.

Such MCP products achieve significantly higher memory performance and density per cubic inch than using several discrete memories.

These parts are ideal for space applications that require high speed, radiation tolerant and compact DDR4 memory as a companion chip to the Teledyne e2v Quad ARM® Cortex® A72 (LS1060) or a Xilinx XQRKU060 devices.

Benefits

• High Density - 4GB
• High Speed - 2.4GT/s target
• Compact Size - 15mm x 20mm x 1.92mm
• Radiation Tolerant
• Suitable for Space Applications

Features

• Density - 4GB / 8GB 
• Bus width - 72 bits (64 bits data + 8 bits ECC)
• Speed - Up to 2400 MT/s 
• Module size - 15mm x 20mm x 1.92mm 
• Solder Spheres Count - 391 
• Pitch - 0.8mm

Space key features

• Space Qualification
  • Up to NASA Level 1 (based on NASA EEE-INST-002 - Section M4 – PEMs) 
  • Up to ECSS Class 1 (ECSS-Q-ST-60-13C) 
• Radiation Tolerance
  • SEL LET Threshold > 60.88 MeV.cm²/mg 
  • SEU LET Threshold 8.19 MeV.cm²/mg | Upset cross-section @ 60.88 MeV.cm²/mg = 5.55E-12 cm²/bit 
  • SEFI LET Threshold 2.6 MeV.cm²/mg | SEFI cross-section @ 60.88 MeV.cm²/mg = 2.22E-4 cm²/device 
  • TID Target 100 krad