New Product Introduction

Infineon Technologies XHP™ 2.XT

IGBT5

Infineon Technologies XHP™ 2.XT product image

High power traction and wind applications require high reliability and robustness, combined with system availability and long lifetime. XHP™ 2 modules with IGBT5 and .XT meet those requirements: IGBT5 allows higher power density, whereas the .XT interconnection technology extends the lifetime by increased thermal and power cycling capabilities.

 

Key features

  • Optimized for low inductive design
  • Extended operation temperature
  • TVjop= 175°C
  • Output current increased by more than 25% compared to IGBT4

 

Additional features

  • Copper bonds for high current carrying capabilities
  • Sintering of chips for highest power cycling capabilities
  • Total losses reduced by up to 20%
  • Package with CTI > 400

 

Applications

  • Wind
  • Traction
  • Solar
  • Energy storage
  • Motor control and drives

 

Related parts

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